Title:
WAFER CARRIER THICKNESS MEASUREMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/105831
Kind Code:
A1
Abstract:
The present invention relates to a wafer carrier thickness measurement device capable of accurately measuring the thicknesses of the inner and outer peripheries of a wafer carrier in a noncontact manner. The present invention provides a wafer carrier thickness measurement device comprising: a first table installed to be rotatable and elevatable and capable of supporting a central portion of a wafer carrier; a second table, disposed outside the first table, which is rotatably installed and capable of supporting an outer peripheral portion of the wafer carrier; upper and lower sensors for measuring a distance from the upper surface to the lower surface of the wafer carrier supported by one of the first and second tables in a noncontact manner to calculate the thickness of the wafer carrier; and a sensor driving means, positioned on one side of the second table, for moving the upper and lower sensors to an upper side or a lower side of the wafer carrier supported by one of the first and second tables.
Inventors:
JUNG SUK JIN (KR)
Application Number:
PCT/KR2017/005870
Publication Date:
June 14, 2018
Filing Date:
June 05, 2017
Export Citation:
Assignee:
SK SILTRON CO LTD (KR)
International Classes:
G01B11/06; G01B11/14; H01L21/304; H01L21/306
Foreign References:
| JPH10125753A | 1998-05-15 | |||
| JPH0649958U | 1994-07-08 | |||
| KR101361382B1 | 2014-02-10 | |||
| KR101322591B1 | 2013-10-28 | |||
| KR100872755B1 | 2008-12-08 |
Attorney, Agent or Firm:
KIM, Ki Moon (KR)
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