Title:
WAFER CENTERING ADJUSTMENT APPARATUS AND ADJUSTMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2024/055756
Kind Code:
A1
Abstract:
A wafer centering adjustment method, comprising: before a wafer (4) is etched, a wafer centering system (1) confirms whether the circle center of the wafer (4) coincides with the center of a first adsorption platform (3), and if not, the wafer centering system (1) corrects the position of the wafer (4); after the wafer (4) is etched, a wafer edge washing effect detection system (2) confirms whether the circle center of the wafer (4) coincides with the center of the first adsorption platform (3) in the wafer etching process, and acquires second offset data; the wafer edge washing effect detection system (2) feeds back the second offset data to the wafer centering system (1); before a next wafer is etched, the wafer centering system (1) first acquires first offset data and performs correction, and then performs secondary correction on the position of the wafer according to the second offset data acquired after the previous wafer is etched, thereby realizing closed-loop control of a centering adjustment apparatus. In addition, the degree of coincidence between the circle center of the wafer and the center of the first adsorption platform is greatly improved by means of secondary correction, thereby effectively guaranteeing the uniformity of the wafer edge etching width.
Inventors:
ZHANG YIPING (CN)
WANG HUI (CN)
WANG HUI (CN)
Application Number:
PCT/CN2023/109214
Publication Date:
March 21, 2024
Filing Date:
July 26, 2023
Export Citation:
Assignee:
ACM RES SHANGHAI INC (CN)
International Classes:
H01L21/68
Foreign References:
| CN112951733A | 2021-06-11 | |||
| CN104979258A | 2015-10-14 | |||
| JPH0685038A | 1994-03-25 | |||
| JPH05343501A | 1993-12-24 | |||
| CN101807537A | 2010-08-18 | |||
| CN114975154A | 2022-08-30 |
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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