Title:
WAFER CHAMFERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/142159
Kind Code:
A1
Abstract:
Provided is a wafer chamfering device such that wafers are chamfered in parallel on a plurality of processing tables, that the throughput is improved, and that the total number of grindstones is restricted, resulting in the cost and the size of the entire device being reduced, and leading to maintenance and management being facilitated. The wafer chamfering device comprises a plurality of processing tables (2A - 2D) whereon the wafers (1) are placed, a plurality of grindstones (3, 4, 5, 6) which have different processing characteristics corresponding to a plurality of processing steps for chamfering the peripheries of the wafers (1), and grindstone moving means for moving the grindstones among the processing tables. Each of the grindstones (3, 4, 5, 6) approaches one of the processing tables (2) and chamfers one of the wafers (1), and then moves to another of the processing tables (2). These operations are repeated, with the result that the plurality of grindstones (3, 4, 5, 6) chamfer the plurality of wafers (1,…1) simultaneously in parallel.
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Inventors:
KATAYAMA Ichiro (Machida Techno Park, 2-5-6, Oyamagaoka 2-chom, Machida-shi Tokyo 15, 〒1940215, JP)
Application Number:
JP2011/054445
Publication Date:
November 17, 2011
Filing Date:
February 28, 2011
Export Citation:
Assignee:
DAITO ELECTRON CO., LTD. (6-11, Miyahara 4-chome Yodogawa-k, Osaka-shi Osaka 03, 〒5320003, JP)
ダイトエレクトロン株式会社 (〒03 大阪府大阪市淀川区宮原４丁目６番１１号 Osaka, 〒5320003, JP)
ダイトエレクトロン株式会社 (〒03 大阪府大阪市淀川区宮原４丁目６番１１号 Osaka, 〒5320003, JP)
International Classes:
B24B9/00; B24B9/10; B24B47/22; H01L21/304
Attorney, Agent or Firm:
DOBASHI Akira (Urban Toranomon Building, 16-4 Toranomon 1-chom, Minato-ku Tokyo 01, 〒1050001, JP)
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Claims: