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Title:
WAFER CLEANING DEVICE AND BONDING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/188121
Kind Code:
A1
Abstract:
This wafer cleaning device (100) cleans a surface (81) of a wafer (80), the device including: a wet cleaning unit (10) that cleans the surface (81) of the wafer (80) with a liquid; and a dry cleaning unit (40) that cleans the surface (81) of the wafer (80) with atmospheric pressure plasma, wherein the dry cleaning unit (40) is disposed to be superimposed above the wet cleaning unit (10).

Inventors:
KIKUCHI HIROSHI (JP)
RI KINN (JP)
Application Number:
PCT/JP2022/016037
Publication Date:
October 05, 2023
Filing Date:
March 30, 2022
Export Citation:
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Assignee:
YAMAHA ROBOTICS HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/02; H01L21/52; H01L21/677
Domestic Patent References:
WO2007148470A12007-12-27
WO2021132133A12021-07-01
WO2010021020A12010-02-25
Foreign References:
JP2012250232A2012-12-20
JP2016225522A2016-12-28
JP2008502135A2008-01-24
JP2008518470A2008-05-29
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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