Title:
WAFER CLEANING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/159416
Kind Code:
A1
Abstract:
Disclosed is a wafer cleaning method, comprising: a step in which a chemical solution for forming a water-repellent protective film is prepared by mixing a first solution containing a silylation agent represented by general formula (R1)a(H)3-aSi-N(R2)2 and a second solution containing a tertiary alcohol; and a step in which the chemical solution is held at least in the recessed parts of the uneven pattern of the wafer, and a water-repellent protective film is formed on the surface of said recessed parts. The quantity of tertiary alcohol with respect to 100% by mass of the total amount of the aprotic solvent which may be contained in the first solution, and the nonaqueous solvent including the tertiary alcohol contained in the second solution is 80 to 100% by mass, and the amount of silylation agent with respect to 100% by mass of the total amount of the first solution and the second solution is 1 to 20% by mass. With this method it is possible to impart stable water repellency to a wafer surface while avoiding deterioration in liquid contact members made from polyvinyl chloride resin.
Inventors:
OKUMURA YUZO (JP)
FUKUI YUKI (JP)
TAKATA TOMOHIRO (JP)
FUKAZAWA HIROKI (JP)
SAIO TAKASHI (JP)
KUMON SOICHI (JP)
FUKUI YUKI (JP)
TAKATA TOMOHIRO (JP)
FUKAZAWA HIROKI (JP)
SAIO TAKASHI (JP)
KUMON SOICHI (JP)
Application Number:
PCT/JP2017/008664
Publication Date:
September 21, 2017
Filing Date:
March 06, 2017
Export Citation:
Assignee:
CENTRAL GLASS CO LTD (JP)
International Classes:
H01L21/304
Foreign References:
| JP2013118347A | 2013-06-13 | |||
| JP2010272852A | 2010-12-02 |
Attorney, Agent or Firm:
KOBAYASHI, Hiromichi et al. (JP)
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