WAFER CONVEYING DEVICE, CHEMICAL MECHANICAL PLANARIZATION APPARATUS AND WAFER CONVEYING METHOD

WIPO Patent Application WO/2022/016623

A1

A wafer conveying device, a chemical mechanical planarization apparatus and a wafer conveying method. The wafer conveying device comprises a manipulator (100) for clamping and carrying a wafer (300), and a transfer table (200) for having the wafer (300) placed thereon, wherein the manipulator (100) comprises a first clamping jaw (101), a second clamping jaw (102), a lifting table (105), a moving mechanism, a rotating mechanism and a control mechanism; and the transfer table (200) comprises a first transfer table (201), a second transfer table (202) and a mounting frame (203). In a conveying process, dry-wet separation can be realized, and a liquid carried by a polished wafer (300) is prevented from contaminating a clean wafer (300), such that the yield of wafers (300) can be increased. Moreover, the first clamping jaw (101) and the second clamping jaw (102) can clamp or release the wafer (300) at the same time, or, one clamps the wafer (300), and the other releases the wafer (300) at the same time, such that the frequent movement of a single clamping jaw is avoided, and the conveying efficiency of the wafer (300) is improved.

YANG YUANSI (CN)
SHEN LINGHAN (CN)
ZHOU ZHIPENG (CN)

PCT/CN2020/107346

January 27, 2022

August 06, 2020

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HANGZHOU SIZONE ELECTRONIC TECH INC (CN)

B24B37/34; B24B7/22; B24B27/00; B24B37/04; H01L21/677; H01L21/687

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US20150357213A1	2015-12-10
JP2004146447A	2004-05-20
CN110176427A	2019-08-27

SHANGHAI HISONG INTELLECTUAL PROPERTY LAW FIRM (GENERAL PARTNERSHIP) (CN)

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