Title:
WAFER CONVEYING DEVICE, CONVEYING METHOD AND CMP APPARATUS CLEANING MODULE
Document Type and Number:
WIPO Patent Application WO/2021/223365
Kind Code:
A1
Abstract:
Disclosed are a wafer conveying device, a conveying method and a CMP apparatus cleaning module. The wafer conveying device comprises: at least one gripping claw clamping arm module, which is used for taking and placing wafers; at least one Z-axis moving module, which is connected to the gripping claw clamping arm module and used for achieving movement of the gripping claw clamping arm module in the Z-axis direction; and at least one X-axis moving module, which is connected to the lower end of the Z-axis moving module and used for achieving the movement of the gripping claw clamping arm module in the Z-axis direction. In the present invention, the X-axis moving module is installed at the lower end of the Z-axis moving module, such that the overall centre of gravity of the wafer conveying device is lowered, the possibility of impurity particles on the wafer conveying device falling onto wafers is reduced, and the cleaning effect of wafers is improved; moreover, the number of X-axis moving modules and the number of Z-axis moving modules are increased, and therefore the wafer conveying time is shortened.
Inventors:
YANG YUANSI (CN)
SHEN LINGHAN (CN)
ZHOU ZHIPENG (CN)
SHEN LINGHAN (CN)
ZHOU ZHIPENG (CN)
Application Number:
PCT/CN2020/120376
Publication Date:
November 11, 2021
Filing Date:
October 12, 2020
Export Citation:
Assignee:
HANGZHOU SIZONE ELECTRONIC TECH INC (CN)
International Classes:
H01L21/677; H01L21/67
Foreign References:
| CN111524847A | 2020-08-11 | |||
| CN200981809Y | 2007-11-28 | |||
| CN207503934U | 2018-06-15 | |||
| CN109524330A | 2019-03-26 | |||
| US4575299A | 1986-03-11 |
Attorney, Agent or Firm:
SHANGHAI HISONG INTELLECTUAL PROPERTY LAW FIRM (GENERAL PARTNERSHIP) (CN)
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