Title:
WAFER CUTTING DEVICE AND METHOD
Document Type and Number:
WIPO Patent Application WO/2018/014637
Kind Code:
A1
Abstract:
A wafer cutting device comprises: an etching unit (1), comprising a clamping piece (11) and an airflow guiding hood (12), wherein the clamp piece comprises a carrying plate (111) and gas channel (112), the carrying plate secures a wafer (4) to be cut and is provided with multiple airholes (111), the gas channel is provided below the carrying plate, and the airflow guiding hood is a double-layer structure comprising an inner layer, an outer layer and a hollow lining layer, is located above the clamping piece, has an adjustable distance, and regulates flow directions of a chemical reaction solution and a protective gas; a gas supply unit (2), in communication with the airflow guiding hood, feeding the protective gas into the inner layer of the airflow guiding hood, connected to the airflow guiding hood, and supplying the protective gas through the airholes to the carrying plate; and a chemical reaction solution supply unit (3), in communication with the airflow guiding hood, and feeding the chemical reaction solution into the lining layer. The technical solution is capable of cutting a large wafer into small wafers at a low cost, satisfying the semiconductor industry research and development demand for completing one part of a process on a large apparatus and another part on a small apparatus, further reducing research and development costs.
Inventors:
XU KAIDONG (BE)
Application Number:
PCT/CN2017/084103
Publication Date:
January 25, 2018
Filing Date:
May 12, 2017
Export Citation:
Assignee:
JIANGSU LEUVEN INSTRUMMENTS CO LTD (CN)
International Classes:
H01L21/02; H01L21/67
Foreign References:
| CN106158709A | 2016-11-23 | |||
| CN104992915A | 2015-10-21 | |||
| CN101880878A | 2010-11-10 | |||
| US20060088983A1 | 2006-04-27 | |||
| US20020025656A1 | 2002-02-28 |
Attorney, Agent or Firm:
BEIJING TRUSTED INTELLECTUAL PROPERTY AGENCY LTD (CN)
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