Title:
WAFER EDGE PROTECTIVE-FILM-FORMING COMPOSITION FOR SEMICONDUCTOR MANUFACTURING
Document Type and Number:
WIPO Patent Application WO/2023/033094
Kind Code:
A1
Abstract:
Provided are a protective film that can completely cover the edge of a substrate (wafer) for semiconductor manufacturing via a simple coating method in the manufacture of a semiconductor device, a protective-film-forming composition for forming the protective film, a wafer for semiconductor manufacturing that is manufactured using the protective film, and a method for manufacturing the wafer for semiconductor manufacturing and a semiconductor device. Also provided is a wafer edge protective-film-forming composition for semiconductor manufacturing, the composition containing a solvent and a polymer or compound having a crosslinkable group. Preferably, the composition has a viscosity of 100 cps or less at 25°C and is photosensitive. Preferably, the crosslinkable group is selected from the group consisting of an epoxy group, a (meth)acrylic group, a vinyl group, a carboxylic acid group, a thiol group, a silanol group, a cinnamoyl group, and a hydroxyl group.
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Inventors:
HATTORI HAYATO (JP)
TAKEDA SATOSHI (JP)
MORIYA SHUNSUKE (JP)
KISHIOKA TAKAHIRO (JP)
SAKAMOTO RIKIMARU (JP)
TAKEDA SATOSHI (JP)
MORIYA SHUNSUKE (JP)
KISHIOKA TAKAHIRO (JP)
SAKAMOTO RIKIMARU (JP)
Application Number:
PCT/JP2022/032897
Publication Date:
March 09, 2023
Filing Date:
September 01, 2022
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
G03F7/027; G03F7/038; G03F7/20; G03F7/38; G03F7/40; H01L21/312
Domestic Patent References:
| WO2018190380A1 | 2018-10-18 | |||
| WO2009104643A1 | 2009-08-27 |
Foreign References:
| JP2014045171A | 2014-03-13 | |||
| JP2017098333A | 2017-06-01 | |||
| JP2011228340A | 2011-11-10 | |||
| JP2016003160A | 2016-01-12 |
Other References:
PROC. SPIE, vol. 3999, 2000, pages 365 - 374
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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