Title:
WAFER FEEDING APPARATUS AND COMPONENT MOUNTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/061103
Kind Code:
A1
Abstract:
This wafer feeding apparatus is provided with a die release device that releases a die D to be picked up from a die sheet by pushing up the lower surface of the die sheet by a push-up pin 71 when a component mounting apparatus picks up the die D from the die sheet to which a wafer W has been attached. The die release device is configured by being provided with: the push-up pin 71; a first lifting device 61 that lifts a first Z-axis slider 63; and a second lifting device 65 that lifts the push-up pin 71 with respect to the first Z-axis slider 63 and that is lifted together with the first Z-axis slider 63.
Inventors:
KAWAGUCHI KOJI (JP)
ICHIKAWA SHIGETO (JP)
ICHIKAWA SHIGETO (JP)
Application Number:
PCT/JP2016/078585
Publication Date:
April 05, 2018
Filing Date:
September 28, 2016
Export Citation:
Assignee:
FUJI MACHINE MFG (JP)
International Classes:
H01L21/67
Foreign References:
| JP3205044U | 2016-06-30 | |||
| JP2008300437A | 2008-12-11 | |||
| JP2008141068A | 2008-06-19 | |||
| JPH0969553A | 1997-03-11 |
Other References:
See also references of EP 3522207A4
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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