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Patent Searching and Data


Title:
WAFER GROUP, WAFER MANUFACTURING DEVICE, AND WAFER MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/098662
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a wafer group which can easily secure uniformity of products manufactured by the wafer group in which the composition varies among the wafers. The present invention further addresses the problem of providing a technology that excludes uncertain elements in forming an orientation flat and forms the orientation flat with extremely high probability and extremely high precision. Provided is a wafer group and a technology relating to the wafer group that comprises a plurality of wafers which are obtained from an identical ingot, and all of which have orientation flats, wherein the plurality of wafers comprise 70 or more of wafers, and the orientation accuracy of the orientation flat in each of the wafers is ±0.010° or lower.

Inventors:
SHOJI SHINYA (JP)
ISHII MAKOTO (JP)
UMETSU KAZUYUKI (JP)
SUGIURA JUNJI (JP)
Application Number:
PCT/JP2015/084529
Publication Date:
June 23, 2016
Filing Date:
December 09, 2015
Export Citation:
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Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
H01L21/304; B28D5/00
Foreign References:
JP2006066643A2006-03-09
JPS63228721A1988-09-22
JP2000124159A2000-04-28
JP2011060985A2011-03-24
JP2012126143A2012-07-05
Attorney, Agent or Firm:
ANIYA Setuo et al. (JP)
Ani store Setsuo (JP)
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