WAFER HANDLING TRAY

WIPO Patent Application WO/2014/087487

A1

A wafer handling tray (1) is provided with: a seal section (44), which is disposed on the rear surface (40) of a main body section (10), and which has an annular seal member (442) that can be brought into contact with a thin film frame (2) placed on other wafer handling tray (1); and engaging sections (111), which are disposed at least at one end section (11) and the other end section (12) of the main body section (10) in the direction parallel to the surface (20) of the main body section (10), and with which a pair of first sections of a processing arm of an external machinery can engage, respectively. The seal member (442) is in contact with the thin film frame (2) such that the seal member surrounds the circumference of a semiconductor wafer (W) adhered to the thin film frame (2) placed on the other wafer handling tray (1), and an airtight space for housing the semiconductor wafer (W) is formed with the one wafer handling tray (1), the other wafer handling tray (1), the seal section (44), and a thin film (F). The position of the main body section (10) is regulated in the direction connecting the front surface (20) of the main body section (10), and the rear surface (40) of the main body section by having the engaging sections (111) engaged with the pair of first sections of the processing arm, respectively.

UMEDA TOSHIYA (JP)
IWAKI TADAO (JP)

PCT/JP2012/081407

June 12, 2014

December 04, 2012

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MIRAIAL CO LTD (JP)

H01L21/673

JP2008028016A	2008-02-07
JP2007314210A	2007-12-06
JP2003197581A	2003-07-11

SHOBAYASHI, Masayuki et al. (JP)
Right wood Masayuki (JP)

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