Title:
WAFER HAVING STEP AND METHOD FOR MANUFACTURING WAFER HAVING STEP
Document Type and Number:
WIPO Patent Application WO/2017/006447
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a wafer having a step, said wafer making it possible not to leave a resist after development, and to provide a method for manufacturing the wafer. This wafer having a step is a wafer that has a step wherein a center portion of one main surface is thin, and an outer peripheral portion is thick, said wafer being characterized in that the step includes a curved surface having a curvature radius of 300-1,800 μm.
Inventors:
TAKEDA NAOYUKI (JP)
Application Number:
PCT/JP2015/069583
Publication Date:
January 12, 2017
Filing Date:
July 08, 2015
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L21/304; B24B1/00; B24B7/22; B24B9/00
Foreign References:
| JP2009253143A | 2009-10-29 | |||
| JP2007103582A | 2007-04-19 | |||
| JP5266869B2 | 2013-08-21 | |||
| JP2011054808A | 2011-03-17 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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