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Patent Searching and Data


Title:
WAFER HOLDER
Document Type and Number:
WIPO Patent Application WO/2013/094491
Kind Code:
A1
Abstract:
A wafer holder (1) has a principal surface (10) and a recessed portion (20) that is recessed in the direction (Z) orthogonal to the principal surface (10). The recessed portion (20) has a bottom surface (30) that is parallel to the principal surface (10), a side surface (50) that is provided from the outer periphery (35) of the bottom surface (30) to the principal surface (10), and a projection (100) that projects from the side surface (50) to the inner side of the recessed portion (20). The projection (100) is provided along the outer periphery (35) of the bottom surface (30), and the height (t) from the bottom surface (30) to the tip (150) of the projection (100) in the orthogonal direction (Z) is taller than half of the height (H) of a wafer arranged in the recessed portion (20) or taller than one third of the height (D) from the bottom surface (30) to the principal surface (10).

Inventors:
KOBAYASHI FUMIYA
Application Number:
PCT/JP2012/082190
Publication Date:
June 27, 2013
Filing Date:
December 12, 2012
Export Citation:
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Assignee:
BRIDGESTONE CORP (JP)
International Classes:
H01L21/683; C23C16/458
Domestic Patent References:
WO2010024943A22010-03-04
Foreign References:
JP2009016567A2009-01-22
JPH1087394A1998-04-07
JP2007251078A2007-09-27
JP2010028013A2010-02-04
JP2009071210A2009-04-02
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (JP)
Hidekazu Miyoshi (JP)
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Claims: