Title:
WAFER HOLDING BODY
Document Type and Number:
WIPO Patent Application WO/2017/010307
Kind Code:
A1
Abstract:
A wafer holding body according to the present invention comprises: a ceramic base body that is disk-shaped and that comprises a wafer mounting surface at an upper surface side; embedded in the base body, for example, an RF electrode; a metal terminal inserted from a lower surface side of the base body; and a connecting terminal that electrically connects the RF electrode and the metal terminal with one another; wherein the connecting terminal comprises a ceramic member preferably having a truncated cone shape of the same material as the base body and a metal layer covering the surface of the ceramic member; and wherein an upper edge portion of the metal layer is connected to the RF electrode and a lower edge portion of the metal layer is connected to the metal terminal via a metal member.
Inventors:
KIMURA KOICHI (JP)
SAKITA SHIGENOBU (JP)
SHINMA KENJI (JP)
SHIMAO DAISUKE (JP)
ITAKURA KATSUHIRO (JP)
NATSUHARA MASUHIRO (JP)
MIKUMO AKIRA (JP)
SAKITA SHIGENOBU (JP)
SHINMA KENJI (JP)
SHIMAO DAISUKE (JP)
ITAKURA KATSUHIRO (JP)
NATSUHARA MASUHIRO (JP)
MIKUMO AKIRA (JP)
Application Number:
PCT/JP2016/069570
Publication Date:
January 19, 2017
Filing Date:
July 01, 2016
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01L21/683; C23C14/50; C23C16/458; C23C16/509; H01L21/3065; H01L21/31
Foreign References:
| JP2014222697A | 2014-11-27 | |||
| JP2006191124A | 2006-07-20 | |||
| JP2006287213A | 2006-10-19 | |||
| JP2005026120A | 2005-01-27 | |||
| JP2007005740A | 2007-01-11 | |||
| JP2003045952A | 2003-02-14 |
Attorney, Agent or Firm:
NAKATA, Motomi et al. (JP)
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