Title:
WAFER HOLDING BODY
Document Type and Number:
WIPO Patent Application WO/2018/100903
Kind Code:
A1
Abstract:
This wafer holding body has: a loading stand provided with a surface for loading an object to be processed on an upper surface thereof; a supporting member that supports the loading stand from a lower surface side of the loading stand; a first cylindrical member one end of which is airtightly joined to the lower surface side of the loading stand; and a second cylindrical member disposed inside the first cylindrical member, and having one end airtightly joined to a lower surface side of the loading stand.
Inventors:
KIMURA KOICHI (JP)
MIKUMO AKIRA (JP)
MIKUMO AKIRA (JP)
Application Number:
PCT/JP2017/037468
Publication Date:
June 07, 2018
Filing Date:
October 17, 2017
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01L21/683; H01L21/02; H05B3/18; H05B3/74
Domestic Patent References:
| WO2007020872A1 | 2007-02-22 |
Foreign References:
| JP2004307939A | 2004-11-04 | |||
| JP2004152865A | 2004-05-27 |
Attorney, Agent or Firm:
NAKATA Motomi et al. (JP)
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