Title:
WAFER IMAGING AND PROCESSING METHOD AND APPARATUS
Document Type and Number:
WIPO Patent Application WO/2009/121133
Kind Code:
A8
Abstract:
A method (1) is disclosed whereby luminescence images are captured (2) from as-cut or partially processed bandgap materials such as multicrystalline silicon wafers. These images are then processed (3) to provide information about defects such as dislocations within the bandgap material. The resultant information is then utilised (4) to predict various key parameters of a solar cell manufactured from the bandgap material, such as open circuit voltage and short circuit current. The information may also be utilised to apply a classification to the bandgap material. The methods can also be used to adjust or assess the effect of additional processing steps, such as annealing, intended to reduce the density of defects in the bandgap materials.
Inventors:
TRUPKE THORSTEN (AU)
BARDOS ROBERT A (AU)
BARDOS ROBERT A (AU)
Application Number:
PCT/AU2009/000396
Publication Date:
September 10, 2010
Filing Date:
March 31, 2009
Export Citation:
Assignee:
BT IMAGING PTY LTD (AU)
TRUPKE THORSTEN (AU)
BARDOS ROBERT A (AU)
TRUPKE THORSTEN (AU)
BARDOS ROBERT A (AU)
International Classes:
H01L31/18; G01N21/66
Attorney, Agent or Firm:
SHELSTON IP (Sydney, NSW 2000, AU)
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