Title:
WAFER INSPECTION DEVICE AND WAFER INSPECTION SYSTEM COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2012/033301
Kind Code:
A2
Abstract:
The present invention relates to a wafer inspection device for inspecting the state of wafer abrasion and for flaws such as cracks, chipping and the like in the peripheral edge of a wafer.
Inventors:
YOO JEONG SOO (KR)
LEE SANG TAI (KR)
SEO JUNG SUK (KR)
CHOI SUNG GON (KR)
LEE SANG TAI (KR)
SEO JUNG SUK (KR)
CHOI SUNG GON (KR)
Application Number:
PCT/KR2011/006455
Publication Date:
March 15, 2012
Filing Date:
August 31, 2011
Export Citation:
Assignee:
HANMI SEMICONDUCTOR CO LTD (KR)
SPO INC (KR)
YOO JEONG SOO (KR)
LEE SANG TAI (KR)
SEO JUNG SUK (KR)
CHOI SUNG GON (KR)
SPO INC (KR)
YOO JEONG SOO (KR)
LEE SANG TAI (KR)
SEO JUNG SUK (KR)
CHOI SUNG GON (KR)
International Classes:
H01L21/66
Foreign References:
| KR20070064376A | 2007-06-20 | |||
| KR200188365Y1 | 2000-07-15 | |||
| KR20040077287A | 2004-09-04 |
Attorney, Agent or Firm:
KIM, Yong In et al. (KR)
김용인 (KR)
김용인 (KR)
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Claims: