Title:
WAFER INSPECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/184807
Kind Code:
A1
Abstract:
The present invention relates to a wafer inspection device. The wafer inspection device comprises: a wafer probing stage configured to move a chuck, on which a wafer is mounted, in vertical and horizontal directions; and a top plate configured to have a probe card mounted at a position opposite to the chuck, the top plate being positioned on the top of the wafer probing stage, and further comprises a tester fixing module for sliding a tester to mount the tester on the upper surface of a substrate or sliding the tester to separate the tester from the substrate, wherein the substrate is the top plate or the probe card.
Inventors:
SHIN BYUNG HYUN (KR)
PARK NAM WOO (KR)
SHIN KI HUN (KR)
PARK NAM WOO (KR)
SHIN KI HUN (KR)
Application Number:
PCT/KR2019/016013
Publication Date:
September 17, 2020
Filing Date:
November 21, 2019
Export Citation:
Assignee:
SEMICS INC (KR)
International Classes:
H01L21/66; G01R1/04; G01R1/073; G01R31/28; H01L21/67
Foreign References:
| KR20030058367A | 2003-07-07 | |||
| KR20040064614A | 2004-07-19 | |||
| KR200258089Y1 | 2001-12-24 | |||
| KR20070057002A | 2007-06-04 | |||
| KR19990074196A | 1999-10-05 | |||
| KR20080062247A | 2008-07-03 | |||
| KR100847577B1 | 2008-07-21 |
Attorney, Agent or Firm:
LEE, Ji Yeon (KR)
Download PDF: