Title:
WAFER INSPECTION METHOD AND WAFER INSPECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/056643
Kind Code:
A1
Abstract:
Provided is a wafer inspection method wherein a chuck top can be properly received. When an aligner 32 receives a chuck top 29 after a wafer W has been inspected, the distance between the chuck top 29 and a chuck base 49 is adjusted by adjusting the inclination of the chuck base 49 such that the chuck top height, which is the distance between the chuck top 29 and the chuck base 49, after the chuck top is held is a height in which any of 0 - 200 µm is added to the chuck top height before the chuck top is held.
Inventors:
YAMADA HIROSHI (JP)
Application Number:
PCT/JP2016/070923
Publication Date:
April 06, 2017
Filing Date:
July 11, 2016
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/66; G01R31/28; H01L21/68
Foreign References:
| JP2014115115A | 2014-06-26 | |||
| JP2015097292A | 2015-05-21 |
Attorney, Agent or Firm:
BECCHAKU, Shigehisa et al. (JP)
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