WAFER-LEVEL SEAL FOR NON-SILICON-BASED DEVICES

Title:

WAFER-LEVEL SEAL FOR NON-SILICON-BASED DEVICES

Document Type and Number:

WIPO Patent Application WO2004021398

Kind Code:

A3

Abstract:

One embodiment disclosed relates to a method (100) for sealing an active area of a non-silicon-based device on a wafer. The method includes providing (104) a sacrificial material over at least the active area of the non-silicon-based device, depositing (108) a seal coating over the wafer so that the seal coating covers the sacrificial material, and replacing (112, 114) the sacrificial material with a target atmosphere. Another embodiment disclosed relates to an SAW device sealed at the wafer level (i.e. prior to separation of the die from the wafer). The device includes an active area to be protected, an electrical contact area (4), and a lithographically-formed structure (24) sealing at least the active area and leaving at least a portion of the electrical contact area (4) exposed.

Inventors:

MILLER GREGORY D
BRUNER MIKE
RAGAN LAWRENCE H
GREEN GARY W

Application Number:

PCT/US2003/018103

Publication Date:

June 03, 2004

Filing Date:

June 09, 2003

Export Citation:

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Assignee:

SILICON LIGHT MACHINES INC (US)

International Classes:

H01L23/02; B81B7/00; H03H3/08; H03H9/02; H03H9/10; H03H9/145; (IPC1-7): H01L29/72

Foreign References:

US5777422A	1998-07-07
US6310420B1	2001-10-30
US6509623B2	2003-01-21

Other References: