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Title:
WAFER MACHINING ADHESIVE TAPE, AND ITS MANUFACTURING METHOD AND USING METHOD
Document Type and Number:
WIPO Patent Application WO/2002/042389
Kind Code:
A1
Abstract:
An adhesive tape having an adhesive layer formed on one face of a base layer. If this tape is adhered to a silicon wafer and the wafer is cut into chips by using a dicer, the chipping and cracking of the chips can be suppressed to the minimum. The adhesive layer of such a tape has a storage elastic modulus G' of 1 MPa or higher at 15 to 35 C ° and preferably has a tan $g(d) of 0.05 or more expressed by the ratio of a loss elastic modulus G' to G'. The adhesive layer is desirably made mainly of an olefin polymer.

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Inventors:
AIHARA SHIN (JP)
KOGA HITOSHI (JP)
Application Number:
PCT/JP2001/010165
Publication Date:
May 30, 2002
Filing Date:
November 21, 2001
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
AIHARA SHIN (JP)
KOGA HITOSHI (JP)
International Classes:
B32B27/00; B32B27/32; C09J7/22; C09J7/38; C09J123/02; C09J153/00; H01L21/301; H01L21/68; H01L21/78; (IPC1-7): C09J7/02; B32B27/00; B29C47/86; B29C47/06; H01L21/301
Domestic Patent References:
WO1997003461A11997-01-30
Foreign References:
JP2000281992A2000-10-10
JP2000281991A2000-10-10
JPH10242086A1998-09-11
JPH1072573A1998-03-17
JPH0912991A1997-01-14
JPH0524150A1993-02-02
EP0542201A11993-05-19
JPH1121519A1999-01-26
JPH10298514A1998-11-10
US5567515A1996-10-22
JPS60166310A1985-08-29
Other References:
See also references of EP 1347025A4
Attorney, Agent or Firm:
Nakajima, Shigemitsu (Kanda Mitoshiro-cho Chiyoda-ku, Tokyo, JP)
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