Title:
WAFER AND MANUFACTURING METHOD THEREFOR, AND MASK
Document Type and Number:
WIPO Patent Application WO/2024/060435
Kind Code:
A1
Abstract:
Embodiments of the present disclosure provide a wafer and a manufacturing method therefor, and a mask. The wafer comprises a substrate, a plurality of chips, and a photoresist layer; the plurality of chips are arranged on the substrate at intervals; the photoresist layer is arranged on the side of the substrate provided with the chips; the photoresist layer is provided with a plurality of accommodating holes; the plurality of accommodating holes are communicated with a plurality of circuit connection parts of the plurality of chips in one-to-one correspondence; the diameters of the plurality of accommodating holes gradually increase from the center of the substrate to the periphery; the accommodating holes are filled with a metal layer; and the metal layer is electrically connected to the circuit connection parts corresponding to the accommodating holes.
Inventors:
LIU SHIZHEN (CN)
Application Number:
PCT/CN2022/140926
Publication Date:
March 28, 2024
Filing Date:
December 22, 2022
Export Citation:
Assignee:
SHANGHAI WINGTECH ELECTRONICS TECHNOLOGY CO LTD (CN)
International Classes:
H01L21/033; H01L21/3213
Foreign References:
| CN115394635A | 2022-11-25 | |||
| CN104280942A | 2015-01-14 | |||
| CN108508695A | 2018-09-07 | |||
| JPH09172020A | 1997-06-30 | |||
| US20180040855A1 | 2018-02-08 | |||
| US5641946A | 1997-06-24 | |||
| CN113921555A | 2022-01-11 | |||
| JP2007251053A | 2007-09-27 |
Attorney, Agent or Firm:
GUANGZHOU DEKE INTELLECTUAL PROPERTY AGENT LTD. (CN)
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