Title:
WAFER-MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/106017
Kind Code:
A1
Abstract:
By irradiating a lasr beam (B) having transparency on the surface of one end side in the height direction of an ingot, a peeling layer is formed at a depth corresponding to the thickness of a wafer. In forming the peeling layer, while moving an irradiation position (PR) of the laser beam in a first direction (Ds), laser scanning that irradiates the laser beam is performed a plurality of times while changing the position in a second direction (Df). In one laser scan, a plurality of laser beams (B1, B2, B3) having different irradiation positions in the first direction and the second direction are irradiated.
Inventors:
YASUDA KOICHIRO (JP)
TAKAGI RYOTA (JP)
KAWAZU TOMOKI (JP)
NOMURA SODAI (JP)
SHIRAI HIDEAKI (JP)
SOLTANI BAHMAN (JP)
SOBAJIMA SHUNSUKE (JP)
TAKAGI RYOTA (JP)
KAWAZU TOMOKI (JP)
NOMURA SODAI (JP)
SHIRAI HIDEAKI (JP)
SOLTANI BAHMAN (JP)
SOBAJIMA SHUNSUKE (JP)
Application Number:
PCT/JP2022/041570
Publication Date:
June 15, 2023
Filing Date:
November 08, 2022
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L21/304; B23K26/00; B23K26/53
Domestic Patent References:
| WO2020090896A1 | 2020-05-07 |
Foreign References:
| JP2017220631A | 2017-12-14 | |||
| JP2020102522A | 2020-07-02 | |||
| JP2015074004A | 2015-04-20 | |||
| JP2014019120A | 2014-02-03 | |||
| JP2021015987A | 2021-02-12 | |||
| JP2019033162A | 2019-02-28 | |||
| JP2020096135A | 2020-06-18 |
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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