Title:
WAFER MOUNTING BASE
Document Type and Number:
WIPO Patent Application WO/2018/038044
Kind Code:
A1
Abstract:
An electrostatic chuck heater 20 comprises an electrostatic chuck 22 and a cooling plate 40 integrated with each other. The electrostatic chuck 22 has a wafer mounting surface 22a and an opposite surface provided with a recess portion 28. A female threaded terminal 30 of a low thermal expansion coefficient metal is inserted into the recess portion 28 and bonded to the recess portion 28 by means of a bonding layer 34 including ceramic fine particles and hard brazing material. A male screw 44 is inserted into a through-hole 42 penetrating through the cooling plate 40, and is threadedly engaged with the female threaded terminal 30. When the female threaded terminal 30 and the male screw 44 are threadedly engaged with each other, play p is provided in a direction in which the cooling plate 40 is displaced with respect to the electrostatic chuck 22 due to a thermal expansion difference.
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Inventors:
AKATSUKA YUJI (JP)
Application Number:
PCT/JP2017/029754
Publication Date:
March 01, 2018
Filing Date:
August 21, 2017
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H01L21/683
Foreign References:
| JP2006344955A | 2006-12-21 | |||
| JPH11228245A | 1999-08-24 | |||
| JP2010272730A | 2010-12-02 | |||
| JP2014208567A | 2014-11-06 | |||
| JP2016103413A | 2016-06-02 |
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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