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Title:
WAFER MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/054682
Kind Code:
A1
Abstract:
A wafer mounting device 10 is provided with: a wafer mounting base 12 including a wafer electrostatic chuck 14 and a wafer cooling plate 16; a focus-ring mounting base 20 including a focus-ring electrostatic chuck 22 and a focus-ring cooling plate 24; and a clamp member 30 disposed on the outer periphery of the focus-ring mounting base 20. The wafer mounting base 12, the focus-ring mounting base 20, and the clamp member 30 are separate members. The focus-ring cooling plate 24 has a pressing portion 24b which presses a wafer cooling plate flange portion 16a against an installing plate 82. The clamp member 30 is fastened onto the installing plate 82 by means of a bolt 86 in a state in which a flange portion 24a is pressed against the installing plate 82 by means of a brim portion 32, whereby the wafer mounting base 12 and the focus-ring mounting base 20 are secured to the installing plate 82 without being directly fastened to the installing plate 82.

Inventors:
TAKEBAYASHI HIROSHI (JP)
Application Number:
PCT/JP2019/035436
Publication Date:
March 19, 2020
Filing Date:
September 10, 2019
Export Citation:
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Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H01L21/3065; H01L21/683; H02N13/00
Foreign References:
JP2014150104A2014-08-21
JP2017174889A2017-09-28
JP2002016126A2002-01-18
JP2014107387A2014-06-09
JP2015220413A2015-12-07
JP2018050039A2018-03-29
JP2007300119A2007-11-15
JP2018107433A2018-07-05
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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