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Title:
WAFER-POLISHING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2000/023229
Kind Code:
A1
Abstract:
A wafer-polishing apparatus using a chemical and mechanical process comprises first and second polishing pads (14, 15); first and second wafer-holding heads (31, 32); a wafer loading section (41); a wafer unloading section (42); first and second head-driving mechanisms for turning the first and second wafer-holding heads above the polishing pad, the wafer loading section (41) and the wafer unloading section (42); a first transport mechanism for carrying wafers to the wafer loading section; and a second transport mechanism for carrying wafers from the wafer unloading section. The first and second polishing pads are adjacent to each other, the wafer loading section and the wafer unloading section are adjacent to each other, the first polishing pad and the wafer loading section are arranged diagonally opposite to each other, and the second polishing pad and the wafer unloading section are arranged diagonally opposite to each other. Since the different transport mechanisms carry wafers to the wafer loading section and from the wafer unloading section, respectively, wafers are substantially protected from dust before polished.

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Inventors:
INABA TAKAO (JP)
NUMOTO MINORU (JP)
SAKAI KENJI (JP)
Application Number:
PCT/JP1999/005716
Publication Date:
April 27, 2000
Filing Date:
October 15, 1999
Export Citation:
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Assignee:
TOKYO SEIMITSU CO LTD (JP)
INABA TAKAO (JP)
NUMOTO MINORU (JP)
SAKAI KENJI (JP)
International Classes:
B24B37/04; B24B41/00; H01L21/00; H01L21/304; (IPC1-7): B24B37/04; H01L21/304
Foreign References:
EP0648575A11995-04-19
JPH09117857A1997-05-06
JPH07130692A1995-05-19
US5649854A1997-07-22
Attorney, Agent or Firm:
Ishida, Takashi (Ishida & Associates Toranomon 37 Mori Building 5-1, Toranomon 3-chome Minato-ku Tokyo, JP)
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