Title:
WAFER POLISHING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2011/083953
Kind Code:
A2
Abstract:
A wafer polishing apparatus is provided. The wafer polishing apparatus includes a first polishing roller disposed on a wafer, the first polishing roller extending in a direction in which the wafer extends and a second polishing roller disposed under the wafer, the second polishing roller extending in the direction in which the wafer extends. The wafer polishing apparatus uses the roller to polish the wafer. Thus, the wafer polishing apparatus may easily polish a wafer having a large area.
Inventors:
LEE, Hyung Rak (265 Bunji, Dae-ui-ri Gogyeong-myeonYeongcheon-si, Gyeongbuk 770-842, KR)
Application Number:
KR2011/000034
Publication Date:
July 14, 2011
Filing Date:
January 05, 2011
Export Citation:
Assignee:
LG SILTRON INC. (274 Imsu-dong, Gumi, Gyeongsangbuk-do 730-350, KR)
LEE, Hyung Rak (265 Bunji, Dae-ui-ri Gogyeong-myeonYeongcheon-si, Gyeongbuk 770-842, KR)
LEE, Hyung Rak (265 Bunji, Dae-ui-ri Gogyeong-myeonYeongcheon-si, Gyeongbuk 770-842, KR)
International Classes:
B24B37/00; H01L21/304
Attorney, Agent or Firm:
SEO, Kyo Jun (9th Fl. Hyun Juk Bldg, 832-41Yeoksam-dong, Gangnam-gu, Seoul 135-080, KR)
Claims: