Title:
WAFER POLISHING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2011/083953
Kind Code:
A3
Abstract:
A wafer polishing apparatus is provided. The wafer polishing apparatus includes a first polishing roller disposed on a wafer, the first polishing roller extending in a direction in which the wafer extends and a second polishing roller disposed under the wafer, the second polishing roller extending in the direction in which the wafer extends. The wafer polishing apparatus uses the roller to polish the wafer. Thus, the wafer polishing apparatus may easily polish a wafer having a large area.
Inventors:
LEE HYUNG RAK (KR)
Application Number:
PCT/KR2011/000034
Publication Date:
December 15, 2011
Filing Date:
January 05, 2011
Export Citation:
Assignee:
LG SILTRON INC (KR)
LEE HYUNG RAK (KR)
LEE HYUNG RAK (KR)
International Classes:
B24B37/08; B24B37/11; H01L21/304
Foreign References:
| JPH1190801A | 1999-04-06 | |||
| JP2000108022A | 2000-04-18 | |||
| JP2009285774A | 2009-12-10 | |||
| JPH1080861A | 1998-03-31 |
Other References:
See also references of EP 2504126A4
Attorney, Agent or Firm:
SEO, Kyo Jun (832-41Yeoksam-dong, Gangnam-gu, Seoul 135-080, KR)
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