Title:
WAFER POLISHING CHAMBER AND WAFER POLISHING SYSTEM INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2017/111196
Kind Code:
A1
Abstract:
An embodiment of a wafer polishing chamber may comprise: a wafer transfer unit; a polishing unit which has an upper platen and a lower platen and polishes a wafer transferred from the wafer transfer unit; a partition wall for separating locations at which the transfer unit and the polishing unit are arranged, respectively; a plurality of fan units for introducing air; and a plurality of exhaust units for exhausting air, wherein at least one of the fan units may be arranged at an upper part of the polishing unit.
Inventors:
LEE SANG HO (KR)
Application Number:
PCT/KR2016/000081
Publication Date:
June 29, 2017
Filing Date:
January 06, 2016
Export Citation:
Assignee:
LG SILTRON INC (KR)
International Classes:
H01L21/67; H01L21/304
Foreign References:
| JP2000158332A | 2000-06-13 | |||
| JP2005259967A | 2005-09-22 | |||
| KR20040070589A | 2004-08-11 | |||
| KR20100053091A | 2010-05-20 | |||
| KR20100073575A | 2010-07-01 |
Attorney, Agent or Firm:
PARK, Young Bok et al. (KR)
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