Title:
WAFER POLISHING DEVICE AND POLISHING HEAD USED FOR SAME
Document Type and Number:
WIPO Patent Application WO/2017/073318
Kind Code:
A1
Abstract:
[Problem] To provide a wafer polishing device with which it is possible to enhance the uniformity of the polishing amount in the wafer surface. [Solution] A wafer polishing device 1, provided with a rotating platen 21 to which a polishing pad 22 is affixed, and a polishing head 10 for holding, while pressing, a wafer W placed on the polishing pad 22. The polishing head 10 is provided with a membrane 16 for coming into contact with the upper surface of the wafer W and applying a pressing force, and a support plate 15 for supporting the membrane 16. The membrane 16 has a main surface part 16a facing the bottom surface of the support plate 15, and side surface parts 16b facing the outer peripheral edge surfaces of the support plate 15. The vertical tensile force due to the side surface parts 16b of the membrane 16 is greater than the lateral tensile force due to the main surface part 16a of the membrane 16.
Inventors:
TERAKAWA RYOYA (JP)
TANIMOTO RYUICHI (JP)
KANEKO HIRONORI (JP)
TANIMOTO RYUICHI (JP)
KANEKO HIRONORI (JP)
Application Number:
PCT/JP2016/080204
Publication Date:
May 04, 2017
Filing Date:
October 12, 2016
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
H01L21/304; B24B37/30
Foreign References:
| JP2015071197A | 2015-04-16 | |||
| JP2013111717A | 2013-06-10 | |||
| JP2007050465A | 2007-03-01 | |||
| JP2005079465A | 2005-03-24 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
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