Title:
WAFER POLISHING METHOD AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/082161
Kind Code:
A1
Abstract:
[Problem] To provide a wafer polishing method and device with which both the flatness and the LPD quality of the wafer can be increased. [Solution] The wafer polishing method according to the present invention is provided with: a first polishing step (step S1) of polishing a wafer using a polishing head of an independent pressurization system which includes a retainer ring enabling a pressing operation to be performed independently of the wafer pressurization mechanism; and a second polishing step (step S3) of polishing the wafer polished in the first polishing step, using a polishing head of a fixed pressurization system including a retainer ring fixed to the wafer pressurization mechanism.
Inventors:
NISHITANI TAKASHI (JP)
TANIMOTO RYUICHI (JP)
TERAKAWA RYOYA (JP)
TANIMOTO RYUICHI (JP)
TERAKAWA RYOYA (JP)
Application Number:
PCT/JP2016/082762
Publication Date:
May 18, 2017
Filing Date:
November 04, 2016
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
H01L21/304; B24B41/06; H01L21/683
Foreign References:
| JP2015193065A | 2015-11-05 | |||
| JPH11221761A | 1999-08-17 | |||
| JP2010274415A | 2010-12-09 | |||
| JP2007067179A | 2007-03-15 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
Download PDF: