Title:
WAFER POLISHING METHOD AND DOUBLE SIDE POLISHING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2010/013390
Kind Code:
A1
Abstract:
Provided is a wafer polishing method wherein the both surfaces of a wafer are simultaneously polished by sandwiching the wafer and sliding the wafer with a pressure by means of at least a lower plate, which is rotary-driven and has a flat polishing upper surface, an upper plate, which is arranged to face the lower plate, is rotary-driven and has a flat polishing lower surface, and a carrier having a wafer holding hole for holding the wafer. The wafer is polished while having the thickness thereof measured from a plurality of holes arranged between the rotating center and the periphery of the upper plate or the lower plate, and a polishing slurry is switched to that of a different polishing speed while the wafer is being polished. Thus, the wafer having high planarity and high smoothness is manufactured with high productivity and high yield.
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Inventors:
FURUKAWA, Daisuke (1393, Oaza Yashiro, Chikuma-sh, Nagano 55, 〒3878555, JP)
古川大輔 (〒55 長野県千曲市大字屋代１３９３番地長野電子工業株式会社内 Nagano, 〒3878555, JP)
ASAI, Kazumasa (1393, Oaza Yashiro, Chikuma-sh, Nagano 55, 〒3878555, JP)
浅井一将 (〒55 長野県千曲市大字屋代１３９３番地長野電子工業株式会社内 Nagano, 〒3878555, JP)
古川大輔 (〒55 長野県千曲市大字屋代１３９３番地長野電子工業株式会社内 Nagano, 〒3878555, JP)
ASAI, Kazumasa (1393, Oaza Yashiro, Chikuma-sh, Nagano 55, 〒3878555, JP)
浅井一将 (〒55 長野県千曲市大字屋代１３９３番地長野電子工業株式会社内 Nagano, 〒3878555, JP)
Application Number:
JP2009/003021
Publication Date:
February 04, 2010
Filing Date:
June 30, 2009
Export Citation:
Assignee:
Shin-Etsu Handotai Co.,Ltd. (6-2 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
信越半導体株式会社 (〒04 東京都千代田区大手町二丁目６番２号 Tokyo, 〒1000004, JP)
FURUKAWA, Daisuke (1393, Oaza Yashiro, Chikuma-sh, Nagano 55, 〒3878555, JP)
古川大輔 (〒55 長野県千曲市大字屋代１３９３番地長野電子工業株式会社内 Nagano, 〒3878555, JP)
ASAI, Kazumasa (1393, Oaza Yashiro, Chikuma-sh, Nagano 55, 〒3878555, JP)
信越半導体株式会社 (〒04 東京都千代田区大手町二丁目６番２号 Tokyo, 〒1000004, JP)
FURUKAWA, Daisuke (1393, Oaza Yashiro, Chikuma-sh, Nagano 55, 〒3878555, JP)
古川大輔 (〒55 長野県千曲市大字屋代１３９３番地長野電子工業株式会社内 Nagano, 〒3878555, JP)
ASAI, Kazumasa (1393, Oaza Yashiro, Chikuma-sh, Nagano 55, 〒3878555, JP)
International Classes:
B24B37/04; B24B49/12; H01L21/304
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (1st Shitaya Bldg. 8F, 6-11 Ueno 7-chome, Taito-k, Tokyo 05, 〒1100005, JP)
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