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Patent Searching and Data


Title:
WAFER POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/192224
Kind Code:
A1
Abstract:
This index-type polishing method uses multiple polishing heads (6, 7, 8, 9) and multiple surface plates to which a polishing cloth (17) is adhered, and simultaneously polishes multiple wafers (W), held by the polishing heads, by rotating the polishing heads while switching the surface plates used to polish the wafers and supplying a polishing agent to the surface plates. This polishing method is characterized by keeping to within 30 seconds the time from interrupting to restarting polishing of a wafer when switching the surface plate and the time from completing polishing of a wafer to starting the operation for detachment from the polishing head, and is further characterized in that, after interrupting or completing polishing of a wafer, pure water or a hydrophilic agent is sprayed from a nozzle (16) to remove bubbles of the polishing agent adhering to the polishing surface of the wafer while rotating the polishing head. In this wafer polishing method, haze irregularities and etching irregularities occurring from during the polishing step or from after completing polishing to starting the detachment operation can be effectively prevented.

Inventors:
SATO MICHITO (JP)
UENO JUNICHI (JP)
ISHII KAORU (JP)
Application Number:
PCT/JP2014/002332
Publication Date:
December 04, 2014
Filing Date:
April 25, 2014
Export Citation:
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Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
H01L21/304; B24B7/00; B24B37/00; B24B37/34
Foreign References:
JP2011142201A2011-07-21
JP2001196340A2001-07-19
JP2001274124A2001-10-05
JP2002510875A2002-04-09
JP2003289058A2003-10-10
JP2011066426A2011-03-31
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (JP)
Good Miya Mikio (JP)
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