Title:
WAFER POST-PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/123603
Kind Code:
A1
Abstract:
Disclosed in the present invention is a wafer post-processing device, comprising a driving mechanism, which vertically clamps a wafer and drives same to rotate; a supply arm, which swings on a side face of the wafer and supplies liquid to the surface of the wafer via a nozzle thereon; and a blocking ring, which is arranged on a periphery side of the driving mechanism to prevent the liquid from sputtering. A flow guide structure is provided at an edge of the blocking ring to prevent liquid at the edge of the blocking ring from accumulating and dripping.
Inventors:
CAO ZILI (CN)
LI CHANGKUN (CN)
LI DENG (CN)
ZHAO DEWEN (CN)
LI CHANGKUN (CN)
LI DENG (CN)
ZHAO DEWEN (CN)
Application Number:
PCT/CN2022/074445
Publication Date:
July 06, 2023
Filing Date:
January 27, 2022
Export Citation:
Assignee:
HWATSING TECH CO LTD (CN)
International Classes:
H01L21/76; B08B3/02; B24B37/34
Foreign References:
| CN107731709A | 2018-02-23 | |||
| CN112670207A | 2021-04-16 | |||
| TW201539610A | 2015-10-16 | |||
| CN104979238A | 2015-10-14 | |||
| JP2015176996A | 2015-10-05 |
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