Title:
WAFER PROBER
Document Type and Number:
WIPO Patent Application WO/2019/143091
Kind Code:
A1
Abstract:
The present invention relates to a wafer prober. The wafer prober has a wafer probing stage comprising: a lower plate; multiple elevating columns mounted on the upper surface of the lower plate; and an upper plate mounted on the upper-end portion of the multiple elevating columns. Each of the multiple elevating columns is configured to move upward/downward between the upper plate and the lower plate, and the height and inclination of the upper plate are adjusted according to the upward/downward movement of the elevating columns. The wafer probing stage adjusts the height of each elevating column according to the load applied to each elevating column such that the height of a chuck placed above the upper plate and the inclination or flatness of the chuck can be adjusted accordingly.
Inventors:
PARK NAM WOO (KR)
PARK KI TACK (KR)
PARK KI TACK (KR)
Application Number:
PCT/KR2019/000573
Publication Date:
July 25, 2019
Filing Date:
January 15, 2019
Export Citation:
Assignee:
SEMICS INC (KR)
International Classes:
H01L21/687; G01R1/04; G01R31/28; H01L21/67
Foreign References:
| KR20110138491A | 2011-12-28 | |||
| JP2010522431A | 2010-07-01 | |||
| KR101794602B1 | 2017-11-07 | |||
| JP2000249185A | 2000-09-12 | |||
| JP2006165523A | 2006-06-22 |
Attorney, Agent or Firm:
LEE, Ji-Yeon (KR)
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