Title:
WAFER PROCESSING APPARATUS AND METHOD
Document Type and Number:
WIPO Patent Application WO/2017/202186
Kind Code:
A1
Abstract:
The present invention relates to an apparatus and a method for wafer processing, and the wafer processing apparatus comprises: a chamber (10), which is a sealed structure having an openable baffle (102) and is provided therein with an immersion tank (101) which has a waste discharge port; a vacuum system (11), which regulates and maintains the pressure within the chamber (10); a gas supply system (12), which includes an inert gas supply unit (121) and an organic solvent vapor supply unit (122) which respectively supply inert gas and organic solvent vapor to the chamber (10); a temperature control system (13), which controls the temperature of the chamber (10). The present invention can better adapt to the trends of development wherein the shapes and appearances of integrated circuit devices are continually evolving from two-dimensional planar structures towards three-dimensional structures, and the intensity thereof is increasingly higher.
Inventors:
XU KAIDONG (BE)
Application Number:
PCT/CN2017/083034
Publication Date:
November 30, 2017
Filing Date:
May 04, 2017
Export Citation:
Assignee:
JIANGSU LEUVEN INSTRUMMENTS CO LTD (CN)
International Classes:
H01L21/02; H01L21/67
Foreign References:
| TW550694B | 2003-09-01 | |||
| CN102148133A | 2011-08-10 | |||
| CN101329134A | 2008-12-24 | |||
| CN101957124A | 2011-01-26 | |||
| CN101210769A | 2008-07-02 | |||
| CN103730331A | 2014-04-16 |
Attorney, Agent or Firm:
BEIJING TRUSTED INTELLECTUAL PROPERTY AGENCY LTD et al. (CN)
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