Title:
WAFER PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/157951
Kind Code:
A1
Abstract:
The present invention relates to a wafer processing apparatus, and more specifically, to a wafer processing apparatus using a high-pressure supercritical fluid to perform a wafer processing process, wherein particle formation and the like due to fluid leakage, friction, and abrasion can be prevented by reducing a drastic change in fluid pressure.
Inventors:
JU JUNG-MYOUNG (KR)
OH SEUNG-MIN (KR)
LEE JOON-HEE (KR)
OH SEUNG-MIN (KR)
LEE JOON-HEE (KR)
Application Number:
PCT/KR2021/001137
Publication Date:
August 12, 2021
Filing Date:
January 28, 2021
Export Citation:
Assignee:
TES CO LTD (KR)
International Classes:
H01L21/67; H01L21/02
Domestic Patent References:
| WO2019031303A1 | 2019-02-14 |
Foreign References:
| KR20180136863A | 2018-12-26 | |||
| KR20190000529A | 2019-01-03 | |||
| KR20160135035A | 2016-11-24 | |||
| JP2013159499A | 2013-08-19 |
Attorney, Agent or Firm:
LEE, Jae-Hong (KR)
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