WAFER PROCESSING DEVICE, FLUID DISCHARGE DEVICE, FLUID SUPPLY DEVICE, AND FLUID SUPPLY METHOD

WIPO Patent Application WO/2021/199611

A1

[Problem] To provide a wafer processing device capable of preventing a decrease in flow volume due to solidification of fluid in a discharge flow path, and discharging the fluid in a short time. [Solution] A wafer processing device 1 is provided with a chamber 20 for performing a predetermined process on a wafer using a supercritical fluid, a fluid supply means 10 for supplying the fluid to the chamber 20, and a fluid discharge device 30 for discharging the fluid from the chamber 20. The fluid discharge device 30 is provided with: a discharge flow path 31; a first pressure adjusting valve 33 provided in the discharge flow path 31 and adjusting the pressure in the chamber 20; a second pressure adjusting valve 35 provided downstream of the first pressure adjusting valve 33 and adjusting the pressure in the discharge flow path 31 downstream of the first pressure adjusting valve 33 to become lower than the pressure in the chamber 20; and a temperature adjusting means 36 for increasing the temperature of the fluid in the discharge flow path 31 between the first pressure adjusting valve 33 and the second pressure adjusting valve 35.

HIFUMI MASATERU (JP)
MIYAMOTO DAISUKE (JP)
HYODO KOSUKE (JP)
SEKIGUCHI HIROFUMI (JP)
ASHIHARA AKIRA (JP)

PCT/JP2021/002169

October 07, 2021

January 22, 2021

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REXXAM CO LTD (JP)

H01L21/304

JP2013016797A	2013-01-24
JP2005142301A	2005-06-02
JP2007152195A	2007-06-21
JP2012049446A	2012-03-08

TANIGAWA, Hidekazu (JP)

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