Title:
WAFER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/087904
Kind Code:
A1
Abstract:
Provided is a wafer processing method by which a wafer of good processed quality can be divided into individual chips, while improving productivity and reducing cost. This wafer processing method is a method by which a wafer (W) in which are formed regions demarcating a plurality of chips by predetermined dividing lines (14) in a device layer (12) formed on the surface of a semiconductor substrate (10) is divided into individual chips along the predetermined dividing lines, wherein the method includes: a groove formation step for irradiating the wafer, from the side of the surface thereof on which the device layer is formed, with laser light induced by a liquid beam, doing so along the predetermined dividing lines, to eliminate the device layer in the predetermined dividing lines as well as to form grooves (16) in the semiconductor substrate; and a back surface processing step for processing the back surface of the wafer, and reducing the thickness of the wafer.
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Inventors:
NOGUCHI SHUN (JP)
CHIBA KIYOTAKA (JP)
CHIBA KIYOTAKA (JP)
Application Number:
PCT/JP2014/082656
Publication Date:
June 18, 2015
Filing Date:
December 10, 2014
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD (JP)
International Classes:
H01L21/301; B23K26/00; B23K26/146; B23K26/364; H01L21/304
Foreign References:
| JP2008153349A | 2008-07-03 | |||
| JP2011091239A | 2011-05-06 | |||
| JP2012004478A | 2012-01-05 | |||
| JP2013125961A | 2013-06-24 | |||
| JP2011101062A | 2011-05-19 | |||
| JP2011056514A | 2011-03-24 |
Attorney, Agent or Firm:
MATSUURA, Kenzo (JP)
Kenzo Matsuura (JP)
Kenzo Matsuura (JP)
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