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Patent Searching and Data


Title:
WAFER-PROCESSING TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/103116
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a wafer-processing tape that does not result in displacement at the interface between the adhesive layer and the sticky agent layer due to expansion, that has uniform expansion properties suitable for a step for dividing the adhesive layer, and that has excellent pickup performance. In the present invention, there is used a wafer-processing tape characterized in comprising: a substrate film; a sticky agent layer formed on the substrate film; and an adhesive layer formed on the sticky agent layer; the shear force of the sticky agent layer and the adhesive layer at 25°C being no less than 0.2 N/mm2, and the peeling force between the sticky agent layer and the adhesive layer at a peeling angle of 180° and a peeling speed of 300 mm/min in a standard state compliant with JIS-Z0237 after being irradiated by an energy beam of 200 mJ/cm2 being no greater than 0.3 N/25 mm.

Inventors:
SANO TORU (JP)
ISHIGURO KUNIHIKO (JP)
MIHARA NAOAKI (JP)
INOMAE CHIKAKO (JP)
YABUKI AKIRA (JP)
TATEBE KAZUKI (JP)
Application Number:
PCT/JP2012/083646
Publication Date:
July 11, 2013
Filing Date:
December 26, 2012
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L21/301; C09J4/00; C09J7/02; C09J133/00; C09J161/28; C09J163/00; C09J175/04; C09J201/02; H01L21/304; H01L21/52
Foreign References:
JP2011216508A2011-10-27
JP2008162240A2008-07-17
JP2008166578A2008-07-17
JP2010251727A2010-11-04
Attorney, Agent or Firm:
INOUE, SEIICHI (JP)
Seiichi Inoue (JP)
Download PDF:
Claims: