Title:
WAFER-PROCESSING TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/103116
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a wafer-processing tape that does not result in displacement at the interface between the adhesive layer and the sticky agent layer due to expansion, that has uniform expansion properties suitable for a step for dividing the adhesive layer, and that has excellent pickup performance. In the present invention, there is used a wafer-processing tape characterized in comprising: a substrate film; a sticky agent layer formed on the substrate film; and an adhesive layer formed on the sticky agent layer; the shear force of the sticky agent layer and the adhesive layer at 25°C being no less than 0.2 N/mm2, and the peeling force between the sticky agent layer and the adhesive layer at a peeling angle of 180° and a peeling speed of 300 mm/min in a standard state compliant with JIS-Z0237 after being irradiated by an energy beam of 200 mJ/cm2 being no greater than 0.3 N/25 mm.
Inventors:
SANO TORU (JP)
ISHIGURO KUNIHIKO (JP)
MIHARA NAOAKI (JP)
INOMAE CHIKAKO (JP)
YABUKI AKIRA (JP)
TATEBE KAZUKI (JP)
ISHIGURO KUNIHIKO (JP)
MIHARA NAOAKI (JP)
INOMAE CHIKAKO (JP)
YABUKI AKIRA (JP)
TATEBE KAZUKI (JP)
Application Number:
PCT/JP2012/083646
Publication Date:
July 11, 2013
Filing Date:
December 26, 2012
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L21/301; C09J4/00; C09J7/02; C09J133/00; C09J161/28; C09J163/00; C09J175/04; C09J201/02; H01L21/304; H01L21/52
Foreign References:
JP2011216508A | 2011-10-27 | |||
JP2008162240A | 2008-07-17 | |||
JP2008166578A | 2008-07-17 | |||
JP2010251727A | 2010-11-04 |
Attorney, Agent or Firm:
INOUE, SEIICHI (JP)
Seiichi Inoue (JP)
Seiichi Inoue (JP)
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Claims: