Title:
WAFER PROCESSING TOOLS AND METHODS THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/150072
Kind Code:
A8
Abstract:
A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane, and the two or more blades may be movable between at least a load cup and a robot access location; wherein the load cup may include a wafer station that is vertically moveable relative a blade located in the load cup and may be configured to remove a wafer from a blade located in the load cup and place a wafer on a blade located in the load cup. Other devices, load cups and methods are also disclosed herein.
Inventors:
RANGARAJAN JAGAN (US)
GOLUBOVSKY EDWARD (US)
VAN DER VEEN SHAUN (US)
WONG JUSTIN HO KUEN (US)
ZUNIGA STEVEN M (US)
GOLUBOVSKY EDWARD (US)
VAN DER VEEN SHAUN (US)
WONG JUSTIN HO KUEN (US)
ZUNIGA STEVEN M (US)
Application Number:
PCT/US2020/012957
Publication Date:
March 04, 2021
Filing Date:
January 09, 2020
Export Citation:
Assignee:
APPLIED MATERIALS INC (US)
International Classes:
H01L21/677; B24B37/34; H01L21/306; H01L21/67; H01L21/68; H01L21/687
Attorney, Agent or Firm:
GOREN, David J. (US)
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