WAFER PRODUCTION METHOD USING PEEL TAPE AND ADHESIVE MATERIAL, PEEL TAPE AND ADHESIVE MATERIAL FOR USE IN SAME

WIPO Patent Application WO/2023/188521

A1

The present invention addresses the problem of providing a wafer production method that makes it possible to remove an adhesive material from a laminate that comprises a wafer and the adhesive material more simply and stably than conventional methods. The present invention also addresses the problem of providing an adhesive material and a peel tape that make it possible to achieve simpler and more stable removal than conventional adhesive materials and peel tapes.　A wafer production method according to the present invention includes a step for using a peel tape to remove an adhesive material from a laminate A that comprises a wafer and the adhesive material. The peel tape contains a silicone adhesive component in an adhesive layer that is to contact the adhesive material. The adhesive material has a surface A that is to contact the peel tape and a surface B that contacts the wafer, and, when P1 is the peel strength at surface A as measured keeping the peel tape at 90° to the adhesive material and P2 is the peel strength at surface B as measured keeping the adhesive material at 90° to the polyimide-coated wafer, the adhesive material has a P1 and a P2 that satisfy the following: the peel strength ratio P1/P2 is at least 6, and P2 is at least 0.5 N/25 mm.

SUZUKI TAKASHI (JP)
UNEZAKI TAKASHI (JP)
YASUI HIROTO (JP)
TANIMOTO SHUHO (JP)
KINOSHITA JIN (JP)

PCT/JP2022/042564

October 05, 2023

November 16, 2022

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MITSUI CHEMICALS TOHCELLO INC (JP)

H01L21/02; B32B27/00; C09J5/00; C09J7/38; C09J7/40; C09J183/04

JP2012031315A	2012-02-16
JP2019087681A	2019-06-06
JP2019046884A	2019-03-22

ASAMURA IP P.C. (JP)

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