Title:
WAFER SEALING APPARATUS AND METHOD FOR OPERATING THE SAME
Document Type and Number:
WIPO Patent Application WO/2024/065168
Kind Code:
A1
Abstract:
The wafer sealing apparatus includes carrier stage, upper sealing component, lower sealing component, clamps, connectors, sealing bag, and nitride-based semiconductor wafer. The upper sealing component and the lower sealing component are disposed at one end of carrier surface of the carrier stage. The clamps are disposed on the carrier surface. The connector connects the clamp and the lower sealing component, and another connector connects another clamp and the lower sealing component. The sealing bag is clamped by the clamps. The nitride-based semiconductor wafer is disposed in the sealing bag. The sealing components extend in a first direction. The connectors are configured to move the clamps along a second direction. The clamps are configured to clamp along a third direction. The first direction is perpendicular to the second direction, and the third direction is perpendicular to the first direction and the second direction.
Inventors:
ZHOU YUCHENG (CN)
Application Number:
PCT/CN2022/121676
Publication Date:
April 04, 2024
Filing Date:
September 27, 2022
Export Citation:
Assignee:
INNOSCIENCE SUZHOU SEMICONDUCTOR CO LTD (CN)
International Classes:
B65B51/10; B65B43/18
Foreign References:
| CN113911454A | 2022-01-11 | |||
| CN114906381A | 2022-08-16 | |||
| JP2006335431A | 2006-12-14 | |||
| CN208931738U | 2019-06-04 | |||
| CN112278443A | 2021-01-29 |
Attorney, Agent or Firm:
BEIJING BESTIPR INTELLECTUAL PROPERTY LAW CORPORATION (CN)
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