Title:
WAFER SEPARATION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2004/051735
Kind Code:
A1
Abstract:
A wafer separation apparatus (2) capable of safely and easily separating a wafer at an increased speed. The center portion of the uppermost wafer is pressed by wafer pressing means provided on the center portion of the lower surface of a support plate (12) capable of moving vertically. In order to disperse the bending stress of the uppermost wafer, wafer suction means (22a to 22d) absorbs two or more pairs of suction positions, each opposing to each other on the peripheral portion of the upper surface of the uppermost wafer, so that the wafer is warped upward at the two or more suction positions and fluid is blown into the portion between the lower surface of the uppermost wafer and the upper surface of the lower wafer, thereby lifting the upper most wafer and separating it.
Inventors:
TSUCHIYA MASATO (JP)
Application Number:
PCT/JP2002/012753
Publication Date:
June 17, 2004
Filing Date:
December 05, 2002
Export Citation:
Assignee:
MIMASU SEMICONDUCTOR INDUSTORY (JP)
TSUCHIYA MASATO (JP)
TSUCHIYA MASATO (JP)
International Classes:
B65G49/06; B65H31/06; H01L21/00; H01L21/683; (IPC1-7): H01L21/68; B65G49/06; B65G49/07; B65G59/04; B65H3/08; B65H3/48
Foreign References:
| JPH0964152A | 1997-03-07 | |||
| JP2001114434A | 2001-04-24 |
Attorney, Agent or Firm:
Ishihara, Shoji (Wakai Bldg. 7-8, Higashi-Ikebukuro 3-chom, Toshima-ku Tokyo, JP)
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