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Title:
WAFER-SUPPORTING MESA AIR SPINDLE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2019/119677
Kind Code:
A1
Abstract:
A wafer-supporting mesa air spindle assembly (100), comprising: a spindle (10), a wafer-supporting mesa (20), the wafer-supporting mesa (20) being provided at one end of the spindle (10); a middle disk (30), the middle disk (30) being sleeved on the spindle (10) and arranged at an interval to the wafer-supporting mesa (20) in the axial direction of the spindle (10); an upper push-stopping disk (40), the upper push-stopping disk (40) being provided between the middle disk (30) and the wafer-supporting mesa (20) and is spaced apart from the middle disk (30) to form a gap, the upper push-stopping disk (40) being provided thereon with a first air hole facing the middle plate (30); and a lower push-stopping disk (50), the lower push-stopping disk (50) being sleeved on the spindle (10) and arranged on the other side of the middle disk (30), the lower push-stopping disk (50) being spaced apart from the middle disk (30) to form a gap, and the lower push-stopping disk (50) being provided thereon with a second air hole facing the middle plate (30).

Inventors:
ZHANG, Wenbin (No. 1, Taihe 3rd Street Beijing Economy and Technology Development Zone, Beijing 6, 100176, CN)
WANG, Zhongkang (No. 1, Taihe 3rd Street Beijing Economy and Technology Development Zone, Beijing 6, 100176, CN)
YANG, Shengrong (No. 1, Taihe 3rd Street Beijing Economy and Technology Development Zone, Beijing 6, 100176, CN)
YI, Zhongbo (No. 1, Taihe 3rd Street Beijing Economy and Technology Development Zone, Beijing 6, 100176, CN)
YAO, Lixin (No. 1, Taihe 3rd Street Beijing Economy and Technology Development Zone, Beijing 6, 100176, CN)
LIU, Guojing (No. 1, Taihe 3rd Street Beijing Economy and Technology Development Zone, Beijing 6, 100176, CN)
LIANG, Jin (No. 1, Taihe 3rd Street Beijing Economy and Technology Development Zone, Beijing 6, 100176, CN)
Application Number:
CN2018/081712
Publication Date:
June 27, 2019
Filing Date:
April 03, 2018
Export Citation:
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Assignee:
CETC BEIJING ELECTRONIC EQUIPMENT CO., LTD. (No. 1, Taihe 3rd Street Beijing Economy and Technology Development Zone, Beijing 6, 100176, CN)
International Classes:
B23B19/02
Foreign References:
CN101786261A2010-07-28
JP2007002862A2007-01-11
CN104014823A2014-09-03
CN102107393A2011-06-29
JPH06341435A1994-12-13
Attorney, Agent or Firm:
DRAGON INTELLECTUAL PROPERTY LAW FIRM (10F Bldg. 2, Maples International CenterNo. 32 Xizhimen North Street, Haidian District, Beijing 2, 100082, CN)
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