Title:
WAFER TRANSFER MECHANISM AND CVD DEVICE HAVING SAME
Document Type and Number:
WIPO Patent Application WO/2019/221356
Kind Code:
A1
Abstract:
The present invention provides a wafer transfer mechanism comprising: a first blade coupled to a robot arm; a second and a third blade each extending from the first blade; an inner mounting part provided to the first blade and supporting one side of a wafer; and outer mounting parts provided to the respective outer sides of the second and third blades and supporting the other side of the wafer, wherein the outer mounting parts each comprise a support block for supporting the inner area of the edge of the other side of the wafer, an edge block spaced apart so as to surround the edge of the wafer, and a recessed groove positioned below the edge of the wafer and formed between the support block and the edge block.
Inventors:
LEE SE RI (KR)
PI JOONG HO (KR)
CHO JANG SU (KR)
PI JOONG HO (KR)
CHO JANG SU (KR)
Application Number:
PCT/KR2018/015918
Publication Date:
November 21, 2019
Filing Date:
December 14, 2018
Export Citation:
Assignee:
SK SILTRON CO LTD (KR)
International Classes:
H01L21/677; C23C16/44; H01L21/67; H01L21/687
Foreign References:
| KR20060035467A | 2006-04-26 | |||
| KR20040107933A | 2004-12-23 | |||
| KR100819114B1 | 2008-04-02 | |||
| US20160218030A1 | 2016-07-28 | |||
| KR20070034314A | 2007-03-28 |
Attorney, Agent or Firm:
LEE, Seung Chan (KR)
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