Title:
WAFERING PROCESS FOR WATER BASED SLURRIES
Document Type and Number:
WIPO Patent Application WO/2017/091945
Kind Code:
A1
Abstract:
Processes for improving the cutting performance of a wire saw utilizing semi-aqueous or aqueous slurries comprises (a) contacting a cutting wire with a cutting slurry composition that comprises: (a.i) an abrasive component; (a.ii) a suspending component; (a.iii) at least one defoamer or wetting agent; (a.iv) water; and (a.v) optionally, at least one water miscible solvent; (b) adjusting a slurry flow rate to greater than or equal to 3000 kg/hr. m; and (c) adjusting a wire speed of the cutting wire to greater than or equal to 1 m/sand within a wire speed range having a wire speed lower limit and a wire speed upper limit wherein the wire speed range is determined by formula (I): (-a1) (x) + b1 ≤ y ≤ (a2) (x) + b2; wherein: "(-a1) (x) + b1" is the wire speed lower limit, "(a2) (x) + b2" is the wire speed upper limit, "x" is the slurry flow rate, "y" is the wire speed, and a1, a2, b1 and b2 each individually are positive coefficients; wherein the viscosity of the slurry is maintained at lower than 1000 cPs for a period of time.
Inventors:
BRAEM MATTHIAS (CN)
FAN ZHAOYU (CN)
FAN ZHAOYU (CN)
Application Number:
PCT/CN2015/095987
Publication Date:
June 08, 2017
Filing Date:
November 30, 2015
Export Citation:
Assignee:
RHODIA OPERATIONS (FR)
SOLVAY (CHINA) CO LTD (CN)
SOLVAY (CHINA) CO LTD (CN)
International Classes:
B28D5/00
Domestic Patent References:
| WO2014174350A1 | 2014-10-30 |
Foreign References:
| US6923171B2 | 2005-08-02 | |||
| CN101850579A | 2010-10-06 |
Attorney, Agent or Firm:
CHINA PATENT AGENT (H.K.) LTD. (CN)
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