Title:
WAGON DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/042172
Kind Code:
A1
Abstract:
A wagon device that conveys a plurality of punches and a plurality of dies used in a punch press to a mold rack device provided with a die support plate, and that is provided with: a movable frame main body which is provided with a plurality of casters; a punch support frame which should be provided above the frame main body and move along with the frame main body, and which detachably supports the plurality of punches; a die support plate which should provided below the punch support frame and move along with the frame main body, and which supports the plurality of dies; a template which should be arranged above the die support plate, and which is provided with a plurality of die engagement holes into which the plurality of dies can be fitted; and a pressing member which is arranged between the die support plate and the template, and which should be configured to press the plurality of dies towards the inner periphery of the respective die engagement hole.
Inventors:
KIMURA SEIICHI (JP)
Application Number:
PCT/JP2013/074484
Publication Date:
March 20, 2014
Filing Date:
September 11, 2013
Export Citation:
Assignee:
AMADA CO LTD (JP)
International Classes:
B21D37/04; B21D28/36
Foreign References:
| JP2002192265A | 2002-07-10 | |||
| JP2007098561A | 2007-04-19 | |||
| JPH09192756A | 1997-07-29 | |||
| JPH07185665A | 1995-07-25 | |||
| JPH11314712A | 1999-11-16 |
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (JP)
Hidekazu Miyoshi (JP)
Hidekazu Miyoshi (JP)
Download PDF: