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Patent Searching and Data


Title:
WALL AND FLOOR STRUCTURE FOR REDUCING INTER-FLOOR NOISE
Document Type and Number:
WIPO Patent Application WO/2016/013835
Kind Code:
A1
Abstract:
The present invention relates to a hard panel of a wall and floor structure for reducing inter-floor noise and, more specifically, to a panel which forms a pattern using materials of which density and modulus of elasticity are different from each other, wherein a delivery pathway is converted horizontally while soundwaves delivered from an upper floor pass through a pattern layer, and soundwave energy is dissipated via incidence, reflection, refraction, and offset of the soundwave to thereby reduce noise. The hard panel of a wall and floor structure for reducing inter-floor noise according to the present invention is capable of effectively reducing light- and heavy-weight impact sound, and effectively dissipating noise by forming a plurality of pattern layers, or a single pattern layer, within the hard panel so as to refract or reflect noise. In addition, sound-absorbing materials which can absorb noise having passed through the hard panel are formed to effectively reduce the noise, and application in existing and newly constructed buildings is easy, thereby exhibiting an effect of cost reduction

Inventors:
HONG JUNG-WUK (KR)
YANG SEUNG-JIN (KR)
LEE SANG-EON (KR)
Application Number:
PCT/KR2015/007521
Publication Date:
January 28, 2016
Filing Date:
July 21, 2015
Export Citation:
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Assignee:
KOREA ADVANCED INST SCI & TECH (KR)
International Classes:
E04B1/86; E04F13/075; E04F15/20
Foreign References:
KR20100049778A2010-05-13
JP2005099402A2005-04-14
KR20060099838A2006-09-20
KR20100000275A2010-01-06
KR20100067848A2010-06-22
Attorney, Agent or Firm:
PARK, YOUNG-WOO (KR)
박영우 (KR)
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